Center for Advanced CMOS & Heterointegration Saxony
Research Platform for 300 mm Frontend and Backend Wafer Level Integration
The Fraunhofer Center for Advanced CMOS & Heterointegration Saxony – CEASAX gives you access to the most advanced technologies - from developing new IP up to pilot fabrication.
With us you will find a strong research partner for the complete process chain for microelectronics, from design over frontend and backend to systems on 300 mm wafers.
As the appointed location for 300 mm wafer technologies in Saxony, the center is part of the »Advanced Heterogeneous System Integration and Advanced Packaging Pilot Line« and a core of R&D value creation within the framework of the European Chips Act.
CEASAX is a joint undertaking of Fraunhofer IZM-ASSID and Fraunhofer IPMS. These two R&D facilities in the field of microelectronics that are the only 300 mm research centers in Germany with industry standard equipment.