Center for Advanced CMOS & Heterointegration Saxony
Center for Advanced CMOS & Heterointegration Saxony

Projects

Overview of Our Joint Projects

Fraunhofer IPMS and Fraunhofer IZM have been working together successfully for years in joint projects by contributing their respective expertise and thus generating fruitful synergies.

Projects

APECS pilot line

Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems

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Projects

FAMES pilot line

Innovation in advanced semiconductor technologies for a sovereign European chip industry (2023 - 2028)

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Projects

Semiconductor technology modules for quantum computing, AI, IoT

TO.QI (2024-2027)

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Projects

PREVAIL: multi-hub Test/Experimentation Facility for edge AI hardware

Prevail (2022-2026)

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Projects

Quantum Computer in the Solid State

Q-Solid (2022-2026)

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Projects

Split Manufacturing of novel and trustworthy Electronics

T4T (2022-2025)

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Projects

Photonic encryption for enhanced cybersecurity

VE-Silhouette (2021-2024)

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