Press Releases

The Fraunhofer Center for Advanced CMOS and Heterointegration Saxony (CEASAX) is driving forward the development of pioneering technologies for microelectronics and has established itself as a key player in the European semiconductor value chain. Through its participation in the APECS pilot line, a core project of the EU Chips Act, and in the TEF project PREVAIL as part of the Digital Europe Program, CEASAX ensures access to cutting-edge technologies and supports stable supply chains in the field of advanced packaging at the 300 mm industry standard. Innovations in chiplet integration offer unique opportunities for smaller, more powerful and more efficient packages at the wafer level.

The Center for Advanced CMOS and Heterointegration Saxony (CEASAX for short) celebrates the roofing ceremony of its new office building. CEASAX is a beacon of semiconductor research and is based on the combined expertise of Fraunhofer IPMS and Fraunhofer IZM-ASSID. The institutes offer the complete value chain in 300 mm microelectronics and thus the prerequisite for high-tech research for future technologies in the state of Saxony.

A flagship of semiconductor research with international reach is emerging in Dresden. Fraunhofer IPMS and Fraunhofer IZM-ASSID are bundling their competences and establishing the Center for Advanced CMOS & Heterointegration Saxony. The center will offer the complete value chain in 300 mm microelectronics, a prerequisite for high-tech research for future technologies.

A flagship of semiconductor research with international reach is emerging in Dresden. Fraunhofer IPMS and Fraunhofer IZM-ASSID are bundling their competences and establishing the Center for Advanced CMOS & Heterointegration Saxony. The center will offer the complete value chain in 300 mm microelectronics, a prerequisite for high-tech research for future technologies.